An important technology in semiconductor prodction,
this method clears various foreing substances
or contaminants from the surface of semiconductor Wafers.
Mold Residue Cleaner
By removing diverse foreing materials and contaminants, the technology ensures a pristine surface,
thus securing the precision and reliability of semiconducotr components, and plays a crucial role
in enhancing the quality of the final products.
Laser Removing
Target: Metallic Residue, Foreign Matter, Organic Matter
Residue
Principle: Physical/Thermal Processing of Focused Laser
All-Surface Scan Processing to Minimize Wafer/Bump
Damage
Scan Processing of Recognition of Residue/Foreign
Matter Defect Areas
Point Matching and Processing of Foreign Matters
Residue Cleaning
Target: Organic Matter Residue, Byproduct of Laser
Processing
Principle : Physical Collision, Thermal Collision
Shrinkage/Expansion
Physical Collision and Breakaway between Particles and Compressed Air
Rapid Cooling(-70 ~ 80 ℃) for Shrinking Deformation
800x Expansion of CO2 Particle to Destruct
Contaminants
Vaporize Directly at Room Temperature and
No Secondary Contamination
Blowing & Suction
Target: Byproduct of Processing, Floating Matter, Gas
Principle : Floating Matter/Gas Flow
Flow Occurrence of Anisotropic Blowing Floating Matter
Isotropic Suction for Preventing Secondary
Contamination
