Laser Removing

Target: Metallic Residue, Foreign Matter, Organic Matter
Residue

Principle: Physical/Thermal Processing of Focused Laser

All-Surface Scan Processing to Minimize Wafer/Bump
Damage

Scan Processing of Recognition of Residue/Foreign
Matter Defect Areas

Point Matching and Processing of Foreign Matters

Residue Cleaning

Target: Organic Matter Residue, Byproduct of Laser
Processing

Principle : Physical Collision, Thermal Collision
Shrinkage/Expansion

Physical Collision and Breakaway between Particles and Compressed Air

Rapid Cooling(-70 ~ 80 ℃) for Shrinking Deformation

800x Expansion of CO2 Particle to Destruct
Contaminants

Vaporize Directly at Room Temperature and
No Secondary Contamination

Blowing & Suction

Target: Byproduct of Processing, Floating Matter, Gas

Principle : Floating Matter/Gas Flow

Flow Occurrence of Anisotropic Blowing Floating Matter

Isotropic Suction for Preventing Secondary
Contamination